Standard specification
IEEE IEC 60297-1/2; PICMG3.0 R3.0
System characteristics
Supports up to 14 slots.
Supports 8U6HP 280mm front card insertion and 8U6HP 70mm rear card insertion.
Dual star or full network architecture backplane.
Redundant hot swappable fan disk.
Optional System Control Protocol.
Optional PEM or PMM module.
Working environment temperature: 0-50 ℃.
Storage temperature: -20~+85 ℃.
Technical parameter
| Model | 79E841114-xxx | |||
| Specifications | 14U14S |
Backboard
|
Base passageway | 1000 Base_T |
| Card insertion direction | horizontal direction | Fabric passageway | 3.125 Gbps LVDS | |
| External dimensions (W x H x D, mm) | 482.6 x 621.5 x 500 | Node slot | 12 | |
| weight | 30kg | Exchange slot | 2 | |
| Heat dissipation capacity | Lower inlet and upper outlet | Topological structure | Double star or full network | |
| The maximum heat dissipation capacity is a single slot300W | IPMB | Star or bus type | ||
| Controllable speed | Update passageway | have | ||
| colour | black | CLK1 | have | |
| Power supply capacity | Dual DC -48V or dual AC 220V, with a maximum output power of 8000W | CLK2 | have | |
| System Control Protocol | IPMI 1.5 or SIMP | CLK3 | have | |